For over 30 years Semiconductor Equipment Corporation has set the standard for high quality dicing tape. Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die require lower tackiness and thicker blades require thicker tape. Visit: http://bit.ly/1SOQGMr For more information, please contact our Tape Specialist at (805) 529-2293 x 11 or sales@semicorp.com.
