• Chip Bonders, Pick & Place Systems
• Chip/Die Bonders
• Wafer/Frame Backlap Tape Applicators
• Pick & Place system
• UV Tape Cure System
• Die Matrix Expander and Die Ejector
• Hot Gas Rework and Hot Gas Module

Auto Dry Cabinets with the following capability:

• 1 % Rh Humidity attainable under 7 minutes
• Heating options for 45°C, 60°C and up to 100°C
• Homogenous humidity throughout the Cabinet
• Real time monitoring at a glance
• Low energy consumption
• Adjust all settings within seconds
• Customizable Modern & Ergonomic design
• Cooling options down to 15°C
• Silent operation
• Automatic door locks
• Datalogger for in depth analysis

The Team at the 2020 IPC-APEX Show